Electronics Manufacturing Services
Automated Assembly

  • Surface Mount Technology, including BGA and micro-BGA placements
  • Convection and Vapor Phase Reflow
  • Selective Soldering
  • High mix, low rate prototyping and production
Manual Assembly

  • Through-Hole Technology
  • Press-Fit Assembly
  • Box Build Integration

Specialty Processes

  • Conformal Coating
  • Flex and Rigid-Flex Assembly
  • Lead and Lead-Free (RoHS) Capabilities
  • Fine Pitch Component Placement
  • 2D & 3D AOI and Xray
  • Vibration Testing
  • BGA Underfill