Electronics Manufacturing Services
Machine Placement & Automated Assembly

  • Surface Mount Technology, including BGA and micro-BGA placements
  • Convection and Vapor Phase Reflow
  • 0201 Placement Capabilities
  • Selective Soldering
Hand Assembly

  • Through-Hole Technology
  • Wave Solder
  • Press-Fit Assembly
  • Box Build Integration

Specialty Processes

  • Conformal Coating
  • Flex and Rigid-Flex Assembly
  • Lead and Lead-Free (RoHS) Capabilities
  • “Quick Turn” Manufacturing
  • Low Rate Prototyping
  • Low Rate Production – 20-30 Assemblies